silver filled electrically conductive thermal interface - silverphase 50



Toll Free: 1-888-201-5546

Comprehensive Thermal Management Material Solutions
die cut silver filled phase change compound
High Performance Electrically Conductive SILVER Filled 50oPhase Change Material 



  • 60oC or 80oC phase-change temperature solutions
  • High performance thermal transfer
  • Thixotropic / prevents compound run out
  • Excellent replacement for thermal greases
  • Solutions for many types of surface types
  • Available in sheets, rolls or various die cut formats
  • Fully customizable-centered around specific requirements
Actaphase Product Benefits
  • 60oC or 80oC phase-change temperature solutions
  • High performance thermal transfer
  • Thixotropic / prevents compound run out
  • Excellent replacement for thermal greases
  • Solutions for many types of surface types
  • Available in sheets, rolls or various die cut formats
  • Fully customizable-centered around specific requirements
Actaphase Product Benefits
  • 60oC or 80oC phase-change temperature solutions
  • High performance thermal transfer
  • Thixotropic / prevents compound run out
  • Excellent replacement for thermal greases
  • Solutions for many types of surface types
  • Available in sheets, rolls or various die cut formats
  • Fully customizable-centered around specific requirements

  • 50oC phase-change temperature
  • Volume Resistivity: 2 ohm-cm
  • Low thermal impedance at various pressures
  • Provides excellent thermally and electrically conductive properties 
  • Thixotropic / prevents compound run-out
  • Available in rolls, sheets or die cuts
  • Flexible Demand - low volume to high volume requirements


Actaphase Product Benefits
  • 60oC or 80oC phase-change temperature solutions
  • High performance thermal transfer
  • Thixotropic / prevents compound run out
  • Excellent replacement for thermal greases
  • Solutions for many types of surface types
  • Available in sheets, rolls or various die cut formats
  • Fully customizable-centered around specific requirements
Actaphase Product Benefits
  • 60oC or 80oC phase-change temperature solutions
  • High performance thermal transfer
  • Thixotropic / prevents compound run out
  • Excellent replacement for thermal greases
  • Solutions for many types of surface types
  • Available in sheets, rolls or various die cut formats
  • Fully customizable-centered around specific requirements
silver filled thermal compound for electronic device cooling

SilverPhase 50 is designed to meet the demanding high performance thermal transfer needs of premium high end device and components on the market today. SilverPhase 50 is an electrically conductive and thermally conductive interface material which utilizes an aluminum substrate carrier in order to deliver a uniform coating of the SilverPhase 50 thermal compound. SilverPhase 50 is designed to phase-change during normal device operating temperatures while maintaining a uniform bond line (mating) thickness adjusting for any flatness or surface imperfections that may exist thus increasing both thermal and electrical conductivity performance of the SilverPhase 50 pad. This, packaged with the ability to drive out air from within the interface makes SilverPhase 50 an optimal solution for many demanding high powered device and components. 


With a solvent free formulation design, SilverPhase 50 is designed to provide efficient thermal transfer by providing precision phase-change of the thermal compound coating and a uniform bond line thickness between device/component and heat sink. The ability to manufacture SilverPhase 50 in a variety of phase-change coating thicknesses, aluminum substrate thicknesses as well as within delivering rolls, sheets and pre-formed die cuts allows us to meet a wide range of application objectives within multiple industries.  



Typical Device Applications

  • Power Modules (IGBT)
  • Power Electronics
  • LED (light emitting diode)
  • Transistors
  • Diodes / Relays
  • Microprocessor
  • Power Semiconductor
  • RF Components
  • Heat Sink / Case Sink
  • Large Surface Area Thermal Transfer
Other Information

  • Manufactured to ISO 9001:2008 Standards
  • RoHs Compliant
  • Halogen Free Compliant
Thermal Compound Coating

  • 50oC Phase-Change Temperature
  • Thermal Impedance -download the technical data sheet above for values

Available Material Formats

  • Log Rolls
  • Slit Rolls
  • Sheets
  • Die Cut Individuals
  • Multiple Die Cuts per Card
  • Die Cut Continuous Reels
Compound Thickness Coating

  • S10 = 0.001" (0.025mm) per side
  • S15 = 0.0015" (0.038mm) per side
Aluminum Foil Thicknesses

  • AL1 = 0.001" (0.025mm)
  • AL2 = 0.002" (0.051mm)

Aluminum substrate is type 1145 (O Temper, Soft). Custom aluminum types as well as copper substrate options available.