electrically insulating thermal interface material



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Comprehensive Thermal Management Material Solutions

thermally conductive pressure sensitive adhesive film tape
Thermally Conductive Pressure Sensitive Adhesive for Device / Heat Sink Mount



  • 60oC or 80oC phase-change temperature solutions
  • High performance thermal transfer
  • Thixotropic / prevents compound run out
  • Excellent replacement for thermal greases
  • Solutions for many types of surface types
  • Available in sheets, rolls or various die cut formats
  • Fully customizable-centered around specific requirements
Actaphase Product Benefits
  • 60oC or 80oC phase-change temperature solutions
  • High performance thermal transfer
  • Thixotropic / prevents compound run out
  • Excellent replacement for thermal greases
  • Solutions for many types of surface types
  • Available in sheets, rolls or various die cut formats
  • Fully customizable-centered around specific requirements
Actaphase Product Benefits
  • 60oC or 80oC phase-change temperature solutions
  • High performance thermal transfer
  • Thixotropic / prevents compound run out
  • Excellent replacement for thermal greases
  • Solutions for many types of surface types
  • Available in sheets, rolls or various die cut formats
  • Fully customizable-centered around specific requirements


  • High Performing Thermally Conductive Mounting Tape
  • Standard 2 Mil (0.051mm) Film Thickness
  • Soft Adhesive Pad Design - Offers Surface Conformability Between Device and Sink
  • Optional Non-Dielectric and Dielectric Substrate Options (Gap Filling)
  • Excellent Solution for LED, IC Chip or Battery Attachment
  • Uniform and Efficient Heat Transfer Characteristics
  • Available in Rolls, Sheets or Die Cuts

Actaphase Product Benefits
  • 60oC or 80oC phase-change temperature solutions
  • High performance thermal transfer
  • Thixotropic / prevents compound run out
  • Excellent replacement for thermal greases
  • Solutions for many types of surface types
  • Available in sheets, rolls or various die cut formats
  • Fully customizable-centered around specific requirements
Actaphase Product Benefits
  • 60oC or 80oC phase-change temperature solutions
  • High performance thermal transfer
  • Thixotropic / prevents compound run out
  • Excellent replacement for thermal greases
  • Solutions for many types of surface types
  • Available in sheets, rolls or various die cut formats
  • Fully customizable-centered around specific requirements
thermally conductive adhesive tape for heat sink mounting

FastelTack 20 is a free standing thermally conductive pressure sensitive adhesive film design for thermal management mounting applications such as IC Chips, Heat Sinks, LED/Heat Sink Mounting and Battery Attachment.  FastelTack T20 offers a low thermal impedance within a pressure sensitive adhesive tape compositioin packaged with a quick stick assembly/mounting method.  Due to its soft film design, T20 offers a high degree of conformability considering its 2 mil (0.051mm) thickness to achieve excellent and uniform heat transfer even at hand applied pressure levels. 


FastelTack T20 eliminates the need for fasteners or clamping hardware due to its quick stick method offering long term adhesion characteristics and reliable thermal transfer.




FastelTack T20 offers excellent long term adhesion to a broad range of substrates.  Available standard as a 2 mil (0.051mm) thick film product, T20 is an unsupported pressure sensitive adhesive supplied on a release liner in continuous rolls, slit rolls, die cut formats or pre-laminated to a wide range of substrates including aluminum foil, copper foil, stainless steel foil, PET films, polyimide films or customer defined substrates.
Typical Device Applications

  • LED / Heat Sink Mounting
  • IC Chip Mount
  • Battery Attachment
  • TO Device / Heat Sink Mounting
  • Microprocessor (CPU)
  • Chassis Assembly
  • Non-Mechanical Heat Sink or Device to Case Sink Mounting
Typical Mounting Surfaces

  • Aluminum / Copper / Stainless
  • Anodized Metal Surfaces
  • FR Substrates
  • Plastic and Polyimide Film 
  • Polyester Films
Other Information

  • RoHs Compliant
  • REACH Compliant
  • Halogen Free Compliant
Thermal Adhesive Film

  • 2 Mil (0.051mm) Thickness
  • Color: Opaque White
  • Thermal Conductivity: 0.7 W/m-K
  • Thermal Impedance - download the technical data sheet above for values

Available Material Formats

  • Master Rolls
  • Slit Rolls
  • Sheets
  • Die Cut Individuals
  • Multiple Die Cuts per Card
  • Die Cut Continuous Reels
Substrate Options

  • Aluminum Foil
  • Copper Foil
  • Kapton MT Film
  • Kapton MT+ Film
  • PET Film
  • Customer Defined Substrates

Single side and double coated versions available.   The use of Kapton film can provide a permanent dielectric barrier as well as provide gap filling characteristics.

The use of aluminum foil or copper foil can provide gap filling characteristics within a non-dielectric pad design.

TIMTEL offers a range of substrate types and thicknesses.